Inspection of surface assembly components. The main components of the inspection include: Solderability, coplanarity and usability of the pin, which should be examined by the inspection department. The detection of the weldability of the components can be extracted with stainless steel tweezers trapped in a tin pot of 235 + 5 C or 230 + 5 centigrade, 2 + 0.2S or 3 + 0.5s. Under 20 times microscopes, the tin condition of the welding end is checked, and more than 90% of the tin in the welding end of the component is required.

As the processing workshop, the following appearance check can be done.

The visual inspection with a magnifying glass or components of the welding end or pin surface oxidation or no pollutants.

The components of the nominal value, specifications, models, precision and the size shall be in compliance with the product process.

SOT, the SOIC pin can not be deformed, the lead spacing for multi lead QFP device under 0.65mm, the pin coplanarity should be less than 0.1mm (by mounting optical detection).

The requirements of cleaning products, labeling after cleaning components do not fall off, and does not affect the performance and reliability of components (after cleaning inspection).